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Piezoelectric pump with flexible venous valves for active cell transmission

《机械工程前沿（英文）》 2022年第17卷第4期 doi: 10.1007/s11465-022-0712-4

摘要： The development of organ-on-a-chip systems demands high requirements for adequate micro-pump performance, which needs excellent performance and effective transport of active cells. In this study, we designed a piezoelectric pump with a flexible venous valve inspired by that of humans. Performance test of the proposed pump with deionized water as the transmission medium shows a maximum output flow rate of 14.95 mL/min when the input voltage is 100 V, and the pump can transfer aqueous solutions of glycerol with a viscosity of 10.8 mPa·s. Cell survival rate can reach 97.22% with a yeast cell culture solution as the transmission medium. A computational model of the electric-solid-liquid multi-physical field coupling of the piezoelectric pump with a flexible venous valve is established, and simulation results are consistent with experimental results. The proposed pump can help to construct the circulating organ-on-a-chip system, and the simple structure and portable application can enrich the design of microfluidic systems. In addition, the multi-physical field coupling computational model established for the proposed piezoelectric pump can provide an in-depth study of the characteristics of the flow field, facilitating the optimal design of the micro-pump and providing a reference for the further study of active cell transport in organ-on-a-chip systems.

关键词： venous valve flexible venous valve cell transmission organ-on-a-chip system piezoelectric device

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用于器官芯片的工程化血管系统 Review

Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇

《工程（英文）》 2022年第9卷第2期页码 131-147 doi: 10.1016/j.eng.2021.06.020

摘要：

器官芯片技术是一种很有前途的三维（3D）动态培养方法，可确保准确高效的细胞培养，在临床前试验中具有替代动物模型的巨大潜力。血管系统是人体内最丰富的器官，在氧气交换和物质传递中起着至关重要的作用，是组织器官生存的决定性因素。因此，必须将血管系统集成到器官芯片中，以重建组织和器官微环境及其生理功能。本文讨论了血管与新兴器官芯片技术之间的协同作用，为复现生理学和疾病特征提供了更好的可能性。此外，回顾了血管化的器官芯片制造过程的不同步骤，包括使用不同生物制造策略的结构制造和组织构建。最后，概述了这项技术在器官和肿瘤培养这个有极具吸引力且快速发展的领域的适用性。

关键词：器官芯片血管生物打印肿瘤芯片

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人体胃肠道–菌群相互作用的工程学研究模型

Marc Mac Giolla Eain, Joanna Baginska, Kacy Greenhalgh, Joëlle V. Fritz, Frederic Zenhausern, Paul Wilmes

《工程（英文）》 2017年第3卷第1期页码 60-65 doi: 10.1016/J.ENG.2017.01.011

摘要：

研究宿主–胃肠道微生物的相互作用已经成为管理人类健康和疾病的关键组成部分。微生理系统的发展正在为研究人员提供前所未有的对于这种复杂关系的获取和理解。这些系统结合了微型工程、微流体和细胞培养的优点，来创建人类肠道中普遍存在的环境条件。在这里我们提出的HuMiX(人类微生物交联对话) 平台，是一个利用这种多学科方法提供具有代表性的人体胃肠道的体外模型系统，用于研究宿主–微生物分子的相互作用。我们总结了使用该平台获得的概念验证结果，强调其对于大大增强我们对宿主–微生物相互作用了解的潜力，且其可能对药物、食品和营养以及医疗保健行业产生的巨大影响。同时讨论了这些技术面临的一些关键问题和挑战。

关键词：微生物微流体肠道芯片 HuMiX

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

《机械工程前沿（英文）》 2013年第8卷第2期页码 118-126 doi: 10.1007/s11465-013-0253-y

摘要：

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.

关键词： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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软硬件协同设计和系统级仿真探索

徐辉,王祖强,王照君

《中国工程科学》 2006年第8卷第4期页码 86-88

摘要：

简要介绍了系统级芯片设计的软硬件协同设计、协同仿真技术和SoC开发中系统级协同仿真的工具，并给出了一个在CCSS（CoCentric system studio）环境下完成软硬件协同仿真的实例。

关键词：片上系统软硬件协同仿真 System C CCSS （CoCentric system studio）

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

《机械工程前沿（英文）》 2012年第7卷第1期页码 29-37 doi: 10.1007/s11465-012-0314-7

摘要：

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

关键词： flip chip defect detection ultrasonic excitation vibration analysis

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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

《能源前沿（英文）》 2018年第12卷第1期页码 109-120 doi: 10.1007/s11708-018-0540-8

摘要： The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodology for such thermoelectric coolers, in which a thermoelectric element’s thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a “heat flux vs. temperature difference” Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduction while removing a particular heat flux. This methodology also provides the possible system level Δ ’s that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study was performed to provide an in-depth demonstration of the optimization procedure for an example application.

关键词： thermoelectric cooling thermal management optimization high flux electronics

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微系统研究的思考和单芯片RF-MEMS研究进展

钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良

《中国工程科学》 2004年第6卷第7期页码 21-25

摘要：

微光机电一体化系统简称微系统，是当今技术发展的前沿领域之一。微系统技术的发展将大大地促进许多产品或装置微型化、集成化和智能化，成倍地提高器件和系统的功能密度、信息密度与互连密度，大幅度地节能降耗，有广阔的应用领域和市场。文章阐述了微系统研究的意义以及微系统基础研究的重要性，概述了用于无线通信设备的MEMS器件的性能，指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一，介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况。

关键词：微系统集成单芯片无线通信系统

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

《机械工程前沿（英文）》 2017年第12卷第4期页码 581-590 doi: 10.1007/s11465-017-0454-x

摘要：

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

关键词： electric field microsensor three-dimensional single-chip in-plane rotation

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

《农业科学与工程前沿（英文）》 2023年第10卷第3期页码 448-457 doi: 10.15302/J-FASE-2023490

摘要：

● Low-value biowaste including wood chip and potato peel was valorized to syngas.

关键词： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

《机械工程前沿（英文）》 2017年第12卷第2期页码 203-214 doi: 10.1007/s11465-017-0421-6

摘要：

Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.

关键词： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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三维芯片成像

Marcus Woo

《工程（英文）》 2020年第6卷第5期页码 485-486 doi: 10.1016/j.eng.2020.03.009

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Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 393-396 doi: 10.1007/s11465-009-0043-8

摘要： This paper presents the development of an integrated sensor using two types of smart materials: electrorheological (ER) fluids and conducting polymers (CPs). The developed ER chip worked as an actuator, and it was driven by different voltages and control frequencies. When the four electrodes are controlled synchronously, the diaphragm acts as a vibrator whose frequency can be adjusted in accordance with the frequency of the electrical signals. The response signals of the CP sensor were recorded, and its properties were analyzed. Experimental results show that the amplitude decreases monotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip. However, the displacement fluctuation of the diaphragm below 20Hz can be detected clearly even if the value is very low. When the vibration frequency is larger than 20Hz, the CP sensor can hardly detect the displacement fluctuation. Thus, the upper limit frequency that the CP sensor can detect is about 20Hz. The practical applications of this microdevice are also discussed.

关键词： electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter